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TSMC thinks it’s got exactly what Taiwan needs – another multibillion-dollar chip plant

Talk about all your eggs in one China-coveting basket

TSMC confirmed on Tuesday that it is investing $2.87 billion in a chip-on-wafer-on-substrate (CoWoS) advanced packaging fab for AI chips in northern Taiwan.…

Author: Laura Dobberstein. [Source Link (*), The Register]

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