Xiaomi XRING O1 Die Shot Reveals Details of 10-Core CPU, 6-Core NPU and More

by #AI [2.0] May 23, 2025 · Automatic / Editor's Picks [News]

Xiaomi XRING O1 was unveiled Thursday on the Xiaomi 15S Pro, marking the company’s first in-house chipset. Built on TSMC’s advanced 3nm N3E process technology, the XRING O1 features a 10-core CPU, 6-core NPU, and 16-core GPU. A die shot of the XRING O1 reveals the layout of various components on the chipset.

Source: https://www.gadgets360.com/mobiles/news/xiaomi-xring-o1-chip-die-shot-layout-tsmc-8487266#rss-gadgets-all

Author: [Gadgets 360]

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